Pixel 9 leak reveals Tensor G4 specs, benchmarks
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After being photographed, the leaked Pixel 9, 9 Pro and 9 Pro XL have now been put through preliminary benchmark tests, while we now have details on the Tensor G4.
According to the results of benchmark tests of Rozetked, the Tensor G4 has a 1+3+4 core configuration with the Cortex-X4 serving as the flagship/flagship. This is followed by three medium Cortex-A720 cores and four small Cortex-A520 cores.
The original Tensor and G2 had a base 2+2+4 configuration, while the G3 went to 1+4+4. Here is the historical comparison:
Tensor | G2 tensor | G3 tensor | Tensor G4 |
2x Cortex-X1 (2.8 GHz) | 2x Cortex-X1 (2.85 GHz) | 1x Cortex-X3 (2.91 GHz) | 1x Cortex-X4 (3.1 GHz) |
2x Cortex-A76 (2.25 GHz) | 2x Cortex-A78 (2.35 GHz) | 4x Cortex-A715 (2.37 GHz) | 3x Cortex-A720 (2.6 GHz) |
4x Cortex-A55 (1.8 GHz) | 4x Cortex-A55 (1.8 GHz) | 4x Cortex-A510 (1.7 GHz) | 4x Cortex-A520 (1.95 GHz) |
With Cortex-X4 (which is used by the Snapdragon 8 Gen 3), Arm touts a 15% performance improvement over the previous generation and 40% greater power efficiency.
On the A720 front, fuel efficiency has increased by 20% over its predecessor, while the A510 shows similar gains of 22%.
These devices are not running the final software and there are months of optimization and tuning ahead. You should take this into account when looking at the AnTuTu benchmarks for the Pixel 9 series Tensor G4. There are some performance gains, with the Pixel 8 included for comparison.
- Pixel 8: 877,443 points
- Pixel 9 (today): 1,016,167
- Pixel 9 Pro (Caiman): 1,148,452
- Pixel 9 Pro XL (Komodo): 1,176,410
![Pixel 9 Tensor G4](https://i0.wp.com/9to5google.com/wp-content/uploads/sites/4/2024/06/pixel-9-tensor-g4-benchmarks-1.jpg?ssl=1)
With the Tensor G5 on the Pixel 10 expected to move to TSMC, the Pixel 9 and the Samsung-made chip could have a significant asterisk for buyers this year. Previous leaks indicated that the Tensor G4 will use Samsung’s latest 4nm process and packaging method. FOWLP (Fan-out Wafer Level Packaging) would continue to improve heat management and energy efficiency.
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News Source : 9to5google.com
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